RedMagic has confirmed the design of its upcoming gaming smartphone, the RedMagic 9 Pro. The company shared a bunch of images of the device on Weibo, a Chinese social media network.
The RedMagic 9 Pro images reveal similar design to the RedMagic 8S Pro
The RedMagic 9 Pro will look somewhat similar to the RedMagic 8S Pro, which is a good thing. Why? Well, because it looks different than the competition. The phone will have a square-ish shape, with extremely thin bezels, and an under-display camera.
That will basically allow you to be truly immersed in the gaming content. It will also include rear cameras that will be flush with the backplate, which is not something we see often these days, especially when it comes to high-end phones.
Speaking of which, this smartphone will be fueled by the Snapdragon 8 Gen 3 SoC, Qualcomm’s latest and greatest chip. You can easily see that it will be made out of metal and glass.
All of its physical keys will be placed on the right-hand side, and that’s also where its shoulder trigger will sit, as they do on the RedMagic 8S Pro. That device turned out to be quite compelling without breaking the bank, so we’re expecting something similar from the RedMagic 9 Pro.
The phone will launch on November 23, and it is coming to global markets too
The RedMagic 9 Pro will launch in China on November 23. The company confirmed that quite recently. That smartphone will almost certainly be coming to global markets too, though, based on what happened with its predecessors.
It is worth noting that the RedMagic 9 Pro+ will also launch, the company has confirmed. The company has also confirmed that the device will be 8.9mm thick. As already mentioned, that will be the thickest point, as the cameras will not protrude on the back.
If you’d like to take a closer look at the phone, check out the images provided below.
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