Rumor: AMD’s EPYC Milan-X CPU to Have 3-d Die Stacking


We now know much more about AMD’s imminent 3-d die stacking generation, because of new tweets from dependable {hardware} leakers (*2*)ExecutableFix and Patrick Schur. Those tweets declare that we will be able to first be expecting to peer this tech at play within the EPYC Milan-X sequence of information middle processors.

See extra

See extra

A 12 months in the past, AMD printed by means of its Monetary Analyst Day 2021 tournament that the chipmaker used to be operating on a brand new breed of processors that might make the most of its (*6*)X3D chip packaging generation. AMD’s X3D hybrid generation is in line with 2.5D packaging and 3-d stacking. In layman phrases, it permits AMD to stack more than a few dies on most sensible of one another within the chipmaker’s multi-chip modules (MCM). Bearing in mind the similarity, X3D is mainly AMD’s reaction to Intel’s Foveros 3-d stacking generation.


The most recent rumors declare that Milan-X would be the first wave of chips to function X3D chip packaging. Given the codename, it is cheap to suppose that Milan-X is created from Zen 3 cores, identical to the EPYC 7003 (Milan) portions. ExecutableFix claims that Milan-X is in line with the Genesis IO-die, alluding to the similar I/O die within Zen 3 EPYC chips.

Then again, we do not be expecting AMD to push the core barrier with Milan-X. At its presentation, the corporate defined that the target at the back of X3D used to be to supply as much as 10X upper bandwidth. Then again, the corporate by no means printed what it deliberate to stack. ExecutableFix thinks that AMD is stacking chiplets, however core complicated dies (CCDs) appear not going, given the cooling that they require.

Due to this fact, AMD could be very most likely stacking reminiscence on Milan-X versus compute dies. Moreover, the diagram that used to be shared at AMD’s Monetary Analyst Day 2021 exhibited a 2×2 format with four interconnected chiplets and four stacked dies above an enormous interposer. The four chiplets are most definitely the compute dies, and we suspect that AMD’s stacking HBM programs on Milan-X. It seems that, there is one stacked die consistent with every person chiplet. The presence of HBM reminiscence would do wonders on an EPYC processor, particularly in a knowledge middle setting that is heavy on workloads which are delicate to bandwidth.

Even on AMD’s roadmap, the X3D processor used to be marked as “long run.” We have not heard anything else about Milan-X till nowadays. Then again, AMD President and CEO Dr. Lisa Su is scheduled to ship the a keynote at Computex 2021 known as “AMD Accelerating – The Top Efficiency Computing Ecosystem” so we would possibly listen some extra about Milan-X very quickly.